Mask aligner (lithography)

Category

Materials synthesis and treatment; Spectroscopy methods and lasers

Manufacturer and Model

Suss Microtec - MA/BA6 Gen4

Specifications

Technical data:

• 350 W exposure lamp, Hg
• Alignment mode: Top side
• Substrate thickness up to 6 mm
• Exposure modes: Proximity, soft contact, hard contact, vacuum contact

Chucks:

• 1" square chuck for pieces at least 10x10 mm up to substrates 1"x1"
• 2x2" square
• 4" (100 mm) wafer

Mask holders:

• 2 inch for 
• 3 inch, possible to use proximity flags
• 5 inch, possibility to use proximity flags

Filters:

• i-line filter
• ND33 filter

Objective:

• 5x
• 7.5 offset