A Memorandum of Understanding (MoU) has been signed, solidifying a commitment among 10 partners to develop semiconductor manufacturing capabilities in Latvia, thus increasing EU independence from other global chip manufacturers.
The memorandum is made up of three key components:
- developing the microchip ecosystem,
- developing educational and research capabilities,
- fostering development and manufacturing capabilities throughout the entire semiconductor supply chain.
Memorandum partners include: Riga Technical University, University of Latvia, University of Latvia – Institute of Mathematics and Computer Science, University of Latvia – Institute of Solid State Physics, LMT, Mikrotik, Tet, the Electronic Communications Office of Latvia, the Liepaja Special Economic Zone, the Confederation of Latvian Employers, the Ministry of Economics of the Republic of Latvia and the Education and Science Ministry of the Republic of Latvia.
https://www.eenewseurope.com/en/latvia-moves-to-boost-semiconductor-manufacturing/
